Benefits at a glance:

  • reliable punching and stamping properties
  • best flatness with good surface finish
  • narrowest thickness tolerance
  • available in all standard sizes

Lapping Carriers

Fine machining of semiconductor materials such as silicon wafers, for example, is a precision operation. Tool and mold manufacturers use the appropriate lapping carriers to achieve precisely defined flatness metrics, ​​even in high-volume production. For decades our precision strip steel for lapping carriers has proven its value, with its consistently uniform microstructure, best flatness metrics ​​and thickness tolerances, and its excellent surface finish. If you would like to know which specifications will ensure success for your application then contact us and speak to our advisers.

Parameters Recommendation
Thickness tolerance T2
Tensile strength range M
Flatness class 4
Roughness class 1
Surface white polished
Thickness t (in) Tolerances ± in
T1 T2 T3 T4 T5
.0008 ≤ t < .0016 .00016 .00012 .00008 .00006
.0016 ≤ t < .0025 .00020 .00016 .00012 .00008
.0025 ≤ t < .0039 .00024 .00020 .00016 .00012 .00008
.0039 ≤ t < .0049 .00028 .00020 .00016 .00012 .00008
.0049 ≤ t < .0063 .00035 .00024 .00020 .00016 .00012
.0063 ≤ t < .0079 .00039 .00028 .00020 .00016 .00012
.0079 ≤ t < .0098 .00043 .00031 .00024 .00016 .00012
.0098 ≤ t < .0124 .00051 .00035 .00028 .00020 .00016
.0124 ≤ t < .0157 .00059 .00043 .00031 .00024 .00016
.0157 ≤ t < .0197 .00067 .00047 .00035 .00024 .00016
.0197 ≤ t < .0248 .00079 .00055 .00039 .00028 .00020
.0248 ≤ t < .0315 .00091 .00067 .00047 .00031 .00024
.0315 ≤ t < .0394 .00106 .00075 .00051 .00035 .00028
.0394 ≤ t < .0492 .00134 .00094 .00067 .00047 .00031
.0492 ≤ t < .0630 .00154 .00110 .00079
.0630 ≤ t < .0689 .00181 .00130 .00091
Thickness t (in) Width w (in) Tolerances ± in
B1 B2 B3
t < .0098 w < .79 .003 .002 .001
.79 ≤ w < 1.97 .004 .003 .002
1.97 ≤ w < 4.92 .006 .004 .003
w ≥ 4.92 .008 .006 .004
.0098 ≤ t < .0197 w < .79 .004 .003 .002
.79 ≤ w < 1.97 .006 .004 .003
1.97 ≤ w < 4.92 .008 .006 .004
w ≥ 4.92 .010 .008 .006
.0197 ≤ t < .0394 w < .79 .006 .004 .003
.79 ≤ w < 1.97 .008 .006 .004
1.97 ≤ w < 4.92 .010 .008 .006
w ≥ 4.92 .012 .010 .006
.0394 ≤ t < .0630 w < .79 .008 .006 .004
.79 ≤ w < 1.97 .010 .008 .006
1.97 ≤ w < 4.92 .012 .010 .006
w ≥ 4.92 .014 .010 .008
.0630 ≤ t ≦ .0689 w < .79 .010 .008 .006
.79 ≤ w < 1.97 .012 .008 .006
1.97 ≤ w < 4.92 .014 .012 .008
w ≥ 4.92 .016 .012 .008

Available in white, blue and yellow

Surface Roughness

Thickness t (in) Roughness (nach DIN EN ISO 4287 : 1998)
Class 1 Class 2 Class 3
t ≤ .0197 Ra ≦ 11.8 µin
Rt ≦ 118 µin
Ra ≦ 9.8 µin
Rt ≦ 98 µin
Ra ≦ 5.1 µin
Rt ≦ 59 µin
.0197 < t ≤ .0276 Ra ≦ 7.9 µin
Rt ≦ 79 µin
.0276 < t ≤ .0394 Ra ≦ 13.8 µin
Rt ≦ 138 µin
.0394 < t ≤ .0689 Ra ≦ 15.7 µin
Rt ≦ 157 µin
Ra ≦ 13.8 µin
Rt ≦ 138 µin
Ra ≦ 11.8 µin
Rt ≦ 118 µin
Thickness t (in) Tensile Strength MPa Eberle Tolerance +/-
Range L Range M Range H
.0008 ≤ t < .0039 HV630 HV25
.0039 ≤ t < .0049 1800 2100 2300 50
.0049 ≤ t < .0069 1800 2050 2250 50
.0069 ≤ t < .0089 1750 2000 2200 50
.0089 ≤ t < .0108 1750 1950 2200 50
.0108 ≤ t < .0148 1700 1900 2150 50
.0148 ≤ t < .0167 1650 1850 2100 50
.0167 ≤ t < .0187 1600 1800 2050 50
.0187 ≤ t < .0207 1550 1750 2000 50
.0207 ≤ t < .0246 1550 1750 2000 50
.0246 ≤ t < .0285 1500 1700 1950 50
.0285 ≤ t < .0325 1500 1700 1950 50
.0325 ≤ t < .0364 1450 1650 1900 50
.0364 ≤ t < .0404 1450 1650 1900 50
.0404 ≤ t < .0453 1450 1650 1900 50
.0453 ≤ t < .0492 1400 1600 1850 50
.0492 ≤ t < .0531 1400 1600 1850 50
.0531 ≤ t < .0620 1400 1600 1850 50
.0620 ≤ t ≤ .0689 1350 1550 1800 50
Thickness t in Flatness deviation P
Class 1 Class 2 Class 3 Class 4
.0008 ≦ t < .0039 P60 P50 P40 P30
.0039 ≦ t < .0079 P50 P40 P30 P20
.0079 ≦ t < .0138 P45 P35 P25 P15
.0138 ≦ t < .0197 P40 P30 P20 P10
.0197 ≦ t ≦ .0689 P35 P25 P15 P10

P15 means maximum flatness deviation of .0015 in per 1 in strip width.

Grade Chemical Composition (percent nominal) Comparison of Norms
C Si Mn Cr DIN Material AISI
Eberle 18 1,00 0,25 0,40 C100S 1.1274 1095